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Failure Analysis
Failure analysis determines why a part or material has failed. The Materials Testing Laboratory employs numerous techniques and equipment to determine if the material or component chosen falls within the specifications called for. Analysis can determine if the part was mishandled, if it was processed improperly, or if the environment caused the failure.
The photo on the left shows an extraneous chip of
silicon detected in an optoelectronic device. The photo on the right
shows an electrical failure of the device caused by the extraneous chip .
This backscatter photomicrograph, taken with a scanning electron
microscope, shows a "brittle" type fracture with grain boundary separation
that is typical of hydrogen embrittlement. Subsequent testing found
1.5 ppm hydrogen in the steel.
The dark material was identified with FTIR as a charred
area on the green solder mask.
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